With advanced connectivity and sensor solutions, innovation leaders and technology entrepreneurs can readily solve the toughest challenges of the 'tomorrow.'
FREMONT, CA: TE Connectivity (TE), a big player in creative connectivity solutions for high-speed computing and networking apps, has launched new Sliver straddle-mount connectors, the new standard form factor supporting an open compute Project (OCP) NIC 3.0, a faceplate-pluggable project. These straddle-mount connectors have been designed to be useful for OCP NIC 3.0 cards in a low profile for easy system maintenance and improved thermal management, a new extension of the Sliver product line.
A straddle mount plug is engineered to hang over a printed circuit board's edge. A straddle-mount connector places its pins far nearer to the printed circuit board plane. It is only used at the edge of a board, as some part of the connector's assembly is usually designed to hang off the board's edge, protruding below the board's plane. This connector style needs mechanical headroom under the board plane. The Sliver straddle-mount connectors' high-density, 0.6 mm pitch also supports next-gen silicon PCIe lane counts, which is where present industry products start to max out. OCP NIC 3.0 cards are straight up and down and faceplate-pluggable, helping to increase airflow through the enclosure and facilitating the design of the system. Sliver straddle-mount products from TE are among the most cost-effective and efficient solutions available on the market.
With the rise of latest high-speed requirements in networking equipment, TE Connectivity has developed a portfolio of Sliver internal cabled and card edge interconnections, including SFF-TA-1002 versions, which is one of the most flexible and efficient solutions in the market. In many applications, data rates and protocols, including PCI Express, SAS and Ethernet, sliver products can be used.
TE Connectivity Ltd is a global technology and manufacturing leader envisioning to create a safer, more sustainable, more productive, and more connected future. The company's connectivity and sensor solutions, proven in the harshest environments, have enabled progress in transportation, industrial applications, medical technology, energy, data communications, and home for more than 75 years.